枚葉式真空貼合装置
Bonding without bubbles under high vacuum and pressure
This machine bonds various types of films onto double surface glass, LCD panels, touch screens, etc. Capable of bonding curved surface and/or uneven surface. It realizes high adhesiveness without bubbles by producing vacuum condition before applying pressure in the vacuum chamber. From 0 up to 10atm can be applied, which eliminates the need for post-process such as autoclaving.
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Demonstration available at Matsuyama factory. Contact us from here.
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Machine appearance |
Movie |
NPC’s vacuum chamber bonding
①Diaphragm sheet bonding |
With heat resistant rubber sheet, adhere films to workpieces with irregular form and/or uneven surface. Maximum pressure: 7atm |
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②Flat plate bonding (with a heater on the upper plate) |
Capable of uniform bonding of double surface glass, etc. Reduces winding of the edges. Maximum pressure: 3atm |
③NPC's originally developped bonding method (Patent pending) |
Capable of applying pressure up to 10atm. Suitable for workpieces with uneven surface and/or workpieces that require high pressure. |
Characteristics
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Vacuum (bubbles) |
Pressure (adhesiveness) | Temperature distribution |
Tact time/ Productivity |
Application |
Price | |
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Vacuum chamber bonding |
〇 | 〇 | 〇 | 〇 | 〇 | △ |
Roll bonding |
△ | × | △ | 〇 | △ | 〇 |
Autoclave bonding | - | 〇 | △ | △ | - | × |
Specifications
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Item | Detail |
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Minimum size of heating plate (W) x (H) |
200mm x 200mm |
Maximum size of heating plate (W) x (H) |
2,400mm x 5,500mm |
Pressing | 0-10atm |
Machinery Business
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Factory Space to Rent ( Temporarilyunavailable)