Bonding without bubbles under high vacuum and pressure
This machine bonds various types of films onto double surface glass, LCD panels, touch screens, etc. Capable of bonding curved surface and/or uneven surface. It realizes high adhesiveness without bubbles by producing vacuum condition before applying pressure in the vacuum chamber. From 0 up to 10atm can be applied, which eliminates the need for post-process such as autoclaving.
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Demonstration available at Matsuyama factory. Contact us from here.
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Machine appearance |
Movie |
NPC’s vacuum chamber bonding
①Diaphragm sheet bonding |
With heat resistant rubber sheet, adhere films to workpieces with irregular form and/or uneven surface. Maximum pressure: 7atm |
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②Flat plate bonding (with a heater on the upper plate) |
Capable of uniform bonding of double surface glass, etc. Reduces winding of the edges. Maximum pressure: 3atm |
③NPC's originally developped bonding method (Patent pending) |
Capable of applying pressure up to 10atm. Suitable for workpieces with uneven surface and/or workpieces that require high pressure. |
Characteristics
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Vacuum (bubbles) |
Pressure (adhesiveness) | Temperature distribution |
Tact time/ Productivity |
Application |
Price | |
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Vacuum chamber bonding |
〇 | 〇 | 〇 | 〇 | 〇 | △ |
Roll bonding |
△ | × | △ | 〇 | △ | 〇 |
Autoclave bonding | - | 〇 | △ | △ | - | × |
Specifications
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Item | Detail |
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Minimum size of heating plate (W) x (H) |
200mm x 200mm |
Maximum size of heating plate (W) x (H) |
2,400mm x 5,500mm |
Pressing | 0-10atm |
Machinery Business
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Factory Space to Rent ( Temporarilyunavailable)